The RF360 is Qualcomm’s front end solution to address the complexities manufacturers face when developing hardware for the world market.
LTE frequency bands are all over the place, from one country to the next. That keeps manufacturers on their toes when working on their latest and greatest. Even Apple’s iPhone 5 has three different versions to accommodate the 40 different LTE bands around the world.
Qualcomm Technologies, the business unit that developed this handy design, claims to have broken through the fragmentation and has a single system level solution which can provide connectivity on 2G, 3G, and 4G across all standards, FDD-LTE, TDD-LTE, WCDMA, EV-DO, CDMA, TD-CDMA, GSM, EDGE.
The front end solution obviously means that there will be more space available for manufactures to push the thinness envelope even further, plus this solution will be combined with Qualcomm Snapdragon chip-sets. There are a number of technical components that make the solution possible, and the details are in the press-release below, but they are nicely summarized in the video below.
The best part is that we will not be waiting long to see this technology make an appearance in our smartphones, the RF360 will launch in the second half of this year. Given Qualcomm’s propensity for a licensed business model, we can expect this technology proliferate quickly.
sources: Qualcomm via Engadget
LTE frequency bands are all over the place, from one country to the next. That keeps manufacturers on their toes when working on their latest and greatest. Even Apple’s iPhone 5 has three different versions to accommodate the 40 different LTE bands around the world.
Qualcomm Technologies, the business unit that developed this handy design, claims to have broken through the fragmentation and has a single system level solution which can provide connectivity on 2G, 3G, and 4G across all standards, FDD-LTE, TDD-LTE, WCDMA, EV-DO, CDMA, TD-CDMA, GSM, EDGE.
The front end solution obviously means that there will be more space available for manufactures to push the thinness envelope even further, plus this solution will be combined with Qualcomm Snapdragon chip-sets. There are a number of technical components that make the solution possible, and the details are in the press-release below, but they are nicely summarized in the video below.
The best part is that we will not be waiting long to see this technology make an appearance in our smartphones, the RF360 will launch in the second half of this year. Given Qualcomm’s propensity for a licensed business model, we can expect this technology proliferate quickly.
sources: Qualcomm via Engadget
Hi,
ReplyDeleteSuch an amazing article. You would love to see my
Latest Mobile News site as well.
Thanks once again.